AMD logo
AMD
Posted 4 days agoVerified live 1d ago

2027 Undergrad Thermal Engineering Intern/Co-Op

Brief overview

Remote
UndergradOr in progress
1,901 H-1B approvalsDept. of Labor
488 green cardsCertified filings
Heat TransferThermodynamicsFluid MechanicsThermal ManagementLiquid Cooling TechnologiesLaboratory Testing and InstrumentationData AcquisitionSolidWorksCreoComputational Fluid Dynamics (CFD)ANSYS IcepakFluentFloTHERMCOMSOLOpenFOAM

About the company

Advanced Micro Devices is a semiconductor company that designs and develops graphics units, processors, and media solutions.

Visa sponsorship history

4 years sponsoring, last filed FY2026H-1B dependent

Data powered by U.S. Department of Labor. This does not guarantee sponsorship for this specific role.
1,901H-1B approved
99%approval rate
464new H-1B hires
488PERM certified
$154,565median wage / yr
H-1B Petition ApprovalsVisas USCIS actually granted: the strongest sign the company sponsors.
2023458
2024641
2025718
202684
LCA Certified ApplicationsAn early filing step, not a visa approval: it signals intent, not confirmed sponsorship.
2023137
2024162
2025125
202695
Green Card (PERM) FilingsCertified green card filings: a long-term commitment to international hires.
202359
2024166
2025255
20268
Top sponsored roles
MTS Silicon Design EngineerSMTS Silicon Design EngineerSr. Silicon Design EngineerSMTS Software Development Eng.MTS Systems Design Eng.
Sponsored employees from
IndiaChinaCanadaSouth KoreaTaiwan

Job description

Summary

AMD develops technologies for AI, high-performance computing, and data center platforms. The Thermal Engineering Intern/Co-op will support the development and evaluation of advanced cooling technologies through thermal and hydraulic characterization, laboratory testing, modeling, simulation, automation, and technical reporting.

Responsibilities

  • We will involve you in the thermal and hydraulic characterization of cooling solutions, including cold plates, manifolds, heat exchangers, coolant loops, and rack-level cooling systems
  • We will provide opportunities for you to evaluate air-cooled and liquid-cooled platforms through thermal, airflow, coolant-flow, and pressure-drop analysis activities
  • We will train you to support laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation activities
  • We will encourage you to develop scripts and tools that automate test execution, data processing, engineering analysis, and reporting activities
  • We will assign projects involving thermal modeling, simulation, and comparison of measured data against design expectations to help identify trends and support performance improvements
  • We will have your involvement in investigating thermal, flow, and power-related issues and working with engineering teams to identify effective solutions
  • We will encourage you to document technical findings and communicate results through engineering reports, presentations, and technical documentation

Skills

  • You are currently enrolled in a U.S.-based university pursuing a Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline
  • Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis
  • Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems
  • Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies
  • CAD software such as SolidWorks or Creo
  • CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM, or similar tools
  • Analytical, problem-solving, communication, and technical documentation skills
  • This role is not eligible for visa sponsorship
  • Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies is a plus

Qualifications

Must Haves

  • You are currently enrolled in a U.S.-based university pursuing a Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline
  • Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis
  • Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems
  • Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies
  • CAD software such as SolidWorks or Creo
  • CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM, or similar tools
  • Analytical, problem-solving, communication, and technical documentation skills
  • This role is not eligible for visa sponsorship

Nice to Haves

  • Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies is a plus

Benefits

  • Hybrid, onsite, or remote work structure throughout the duration of the co-op/internship term

More jobs like this