IBM
Posted 4 days agoVerified live 18h ago
Hardware Intern 2027: Advanced Solder Processes
Brief overview
Yorktown Heights, New York, USIn-person
UndergradOr in progress
$88k–$162k/yrStated range
6,375 H-1B approvalsDept. of Labor
1,221 green cardsCertified filings
Lab equipment operation and maintenanceProject management and documentation
About the company
IBMibm.com
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
Visa sponsorship history
4 years sponsoring, last filed FY2026
Data powered by U.S. Department of Labor. This does not guarantee sponsorship for this specific role.6,375H-1B approved
99%approval rate
1,631new H-1B hires
1,221PERM certified
$122,179median wage / yr
H-1B Petition ApprovalsVisas USCIS actually granted: the strongest sign the company sponsors.
20232,485
20241,574
20252,045
2026271
LCA Certified ApplicationsAn early filing step, not a visa approval: it signals intent, not confirmed sponsorship.
2023566
2024566
2025418
2026170
Green Card (PERM) FilingsCertified green card filings: a long-term commitment to international hires.
2023526
2024360
2025303
202632
Top sponsored roles
Application DeveloperApplication ArchitectPackage ConsultantSoftware DeveloperTest Specialist
Sponsored employees from
IndiaChinaBrazilCanadaMexico
Job description
Description
Job Title
Hardware Intern 2027: Advanced Solder Processes
Date posted
30-Sep-2026
Job ID
134618
City / Township / Village
Yorktown Heights
State / Province
New York
Country
United States
Work arrangement
Onsite
Area of work
Infrastructure & Technology
Employment type
Co-Op (Fixed Term)
Contract type
Internship
Projected Minimum Salary per year
88,200.00
Projected Maximum Salary per year
161,700.00
Position type
Internship
Travel required
No Travel
Company
(0147) International Business Machines Corporation
Shift
General (daytime)
Is this role a commissionable/sales incentive based position?
No
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