Hardware Engineer

Summary

The confidential company is seeking a mid-level Component Engineer for a contract engagement supporting hardware development and manufacturing pipelines. The role focuses on evaluating component specifications, defining packaging and handling requirements, managing compliance risks related to ESD and moisture sensitivity, and maintaining component documentation and databases.

Responsibilities

• Review and analyze component datasheets, engineering drawings, and technical specifications to understand physical, electrical, and environmental constraints
• Determine and document correct packaging methods (e.g., tape and reel, trays, tubes) and handling instructions based on industry standards and manufacturing requirements
• Identify Moisture Sensitivity Levels (MSL) and Electrostatic Discharge (ESD) classifications to establish appropriate protective storage and handling protocols
• Potentially work with logistics, engineering, component manufacturers and distributors to resolve technical discrepancies regarding packaging configurations and shipping standards
• Update internal component databases, Product Lifecycle Management (PLM) systems, and Approved Vendor Lists (AVL) with accurate packaging and compliance metadata
• Identify obsolete packaging types, or non-compliant supplier practices and propose actionable alternatives to engineering and procurement teams

Skills

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical discipline
• 3 to 5 years of experience in component engineering, hardware manufacturing, or quality engineering
• Deep understanding of electronic component packaging types (SMD, Through-Hole, BGA, QFN) and industry standards such as IPC/JEDEC (e.g., J-STD-020, J STD-033) and ANSI/ESD S20.20
• Hands-on experience using PLM software (such as PTC commonPDM) and component database tools (like SiliconExpert or IHS Markit)
• Proven ability to meticulously interpret complex technical datasheets and mechanical drawings
• Clear written and verbal communication skills needed to collaborate across cross-functional teams

Qualifications

Must Haves

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical discipline
• 3 to 5 years of experience in component engineering, hardware manufacturing, or quality engineering
• Deep understanding of electronic component packaging types (SMD, Through-Hole, BGA, QFN) and industry standards such as IPC/JEDEC (e.g., J-STD-020, J STD-033) and ANSI/ESD S20.20
• Hands-on experience using PLM software (such as PTC commonPDM) and component database tools (like SiliconExpert or IHS Markit)
• Proven ability to meticulously interpret complex technical datasheets and mechanical drawings
• Clear written and verbal communication skills needed to collaborate across cross-functional teams

Benefits

• Remote opportunity